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CY11152 Copper Coated Glass

Catalog No
CY11152
Material
Copper, Borosilicate
Purity
Cu: ≥99.999%
Form
Substrate

Copper Coated Glass is a specialized substrate designed for semiconductor manufacturing applications. It features a thin copper film applied to a borosilicate glass base, enhancing electrical conductivity for precise current distribution. Stanford Electronics employs advanced sputtering and chemical vapor deposition techniques to achieve optimal copper layer quality. Rigorous quality control, including optical inspection and profilometry, ensures film uniformity and reliable adhesion, meeting the stringent requirements of semiconductor processes.

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CY11152 Copper Coated Glass
CY11152 Copper Coated Glass
Description
Specifications
Reviews
FAQ
CY11152 Copper Coated Glass Description

Copper Coated Glass Description

Copper Coated Glass is crafted through a meticulous deposition process, where a thin copper film is uniformly applied to a borosilicate glass substrate. This technique ensures precise control over film thickness and uniformity, which are crucial for maintaining electrical performance in semiconductor processes. The result is a substrate with excellent conductivity and mechanical stability, making it ideal for advanced semiconductor applications.

Copper Coated Glass Characteristics

Parameter

Value

Material

Copper, Borosilicate Glass

Purity

Cu: ≥99.999%

Form

Substrate

Dimensions

25*75*1 mm

Adhesion Layer

Titanium (30 Å)

Copper Thickness

1000 Å

Coating Area

Single Size (or customized)

*The above product information is based on theoretical data and is for reference only. Actual specifications may vary.

Copper Coated Glass Applications

Electronics

  • Interconnect Seed Layer: Used in microelectronic circuits to achieve uniform current distribution by leveraging the copper film's conductive properties.

  • Sensor Electrode Substrate: Applied in display systems to enable stable signal conduction through the copper film.

Semiconductor Manufacturing

  • Metallization Base: Used to ensure firm adhesion of subsequent metal layers in semiconductor devices, with precise control over film thickness.

  • Thin-Film Transistor Foundation: Serves as a base for thin-film transistors, improving charge distribution thanks to its high conductivity.

Copper Coated Glass Packaging

The Copper Coated Glass substrates are packaged in anti-static, cushioned carriers to prevent mechanical damage and contamination. Each substrate is individually wrapped in inert film to protect against particle deposition and moisture ingress. For optimal storage, keep the material in a clean, dry environment at controlled room temperature. Custom packaging options, including barrier sealing and temperature regulation, are available to meet specific processing needs.

Additional Information

Copper Coated Glass substrates are part of a class of materials where thin metal films are deposited onto insulating substrates, a technique widely used in semiconductor manufacturing. The controlled deposition process ensures precise electrical and physical properties, vital for electronic and semiconductor applications. The interplay between copper's excellent conductivity and glass's insulating properties makes this material an essential component in modern electronic systems. With advanced deposition methods and stringent quality control, these substrates meet the high standards required for semiconductor fabrication.

CY11152 Copper Coated Glass Specifications

Parameter

Value

Material

Copper, Borosilicate

Purity

Cu: ≥99.999%

Form

Substrate

Dimensions

25*75*1 mm

Adhesion Layer

Titanium (30 Å)

Copper Thickness

1000 Å

Coating Area

Single Size (or customized)

*The above product information is based on theoretical data and is for reference only. Actual specifications may vary.

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FAQ
Copper Coated Glass, copper thin film, glass substrate, semiconductor raw materials, electrically conductive film, thin film deposition, optical inspection, sputtering process

The copper layer improves electrical conductivity and ensures uniform current distribution, acting as a reliable seed layer for subsequent metal layers.

How does the deposition process affect copper adhesion?

The deposition process controls film thickness and surface energy, promoting strong adhesion between the copper and glass, reducing delamination risks.

What quality control is used during the copper coating process?

Optical inspection and profilometry verify film uniformity and detect defects, ensuring substrates meet precise semiconductor standards.

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