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Palladium (Pd) Coated Silicon Wafer is designed with an ultra-thin palladium layer sputter-deposited on a silicon substrate to address key challenges in semiconductor processing. Stanford Electronics uses precise deposition techniques and comprehensive in-line surface quality inspections with advanced metrology tools to minimize surface defects and ensure uniformity. This approach creates an effective interface for subsequent processing steps, offering enhanced stability and process control for microfabrication environments.
Palladium (Pd) Coated Silicon Wafer is a silicon substrate featuring an ultra-thin palladium film, ideal for semiconductor fabrication. The palladium film serves as a barrier against metal diffusion and oxidation during high-temperature processing, enhancing the stability of the interface. This material is fully compatible with standard semiconductor equipment, making it an essential choice for advanced microfabrication processes.
|
Parameter |
Value |
|
Material |
Palladium, Glass |
|
Purity |
Pd: ≥99.95% |
|
Form |
Substrate |
|
Dimensions |
Dia.: 4 inch * 0.525 mm |
|
Adhesion Layer |
Titanium (30 Å) |
|
Pd Thickness |
1000 Å |
|
Coating Area |
Single Size (or customized) |
The above product information is based on theoretical data and is for reference only. Actual specifications may vary.
1. Semiconductor Manufacturing
Diffusion Barrier: The palladium layer prevents metal migration, making it ideal for microelectronic device fabrication.
High-Temperature Processing: Preserves the integrity of the substrate during high-temperature processes, maintaining uniformity and stability.
2. Electronics Testing and Research
Substrate for Experimental Structures: Used to study barrier layer performance and interactions during thermal cycles.
Process Development: Frequently employed in labs to explore the effects of metal coatings on silicon during device scaling.
The wafers are packaged in static-dissipative, anti-scratch trays with a sealed plastic cover to protect against particulate contamination. Each wafer is enclosed in moisture-resistant, anti-static foil and stored in cleanroom-grade containers, ensuring the preservation of surface quality. Custom packaging options, including specialized sealing and labeling, are available to meet specific storage and transportation needs.
Palladium-coated silicon wafers represent a critical material for semiconductor processing, offering solutions to challenges related to thermal stability and material interactions. The integration of palladium as a barrier layer improves the overall performance of microelectronic devices by enhancing interface stability. Stanford Electronics employs advanced deposition techniques and rigorous quality control to optimize these wafers for use in cutting-edge semiconductor applications.
|
Parameter |
Value |
|
Material |
Palladium, Glass |
|
Purity |
Pd: ≥99.95% |
|
Form |
Substrate |
|
Silicon Specification |
P-Type <100> |
|
Dimensions |
Dia.: 4 inch * 0.525 mm |
|
Adhesion Layer |
Titanium (30 Å) |
|
Pd Thickness |
1000 Å |
|
Coating Area |
Single Size (or customized) |
The above product information is based on theoretical data and is for reference only. Actual specifications may vary.
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