Palladium (Pd) Coated Glass Description

Palladium (Pd) Coated Glass is a high-performance glass substrate with a thin palladium layer applied using controlled sputtering techniques. The palladium layer enhances the surface conductivity and chemical inertness, serving as an effective barrier to oxidation and contamination in semiconductor processing. This uniform film thickness ensures consistency in microfabrication and supports high-precision applications in crystal substrate production.

Palladium (Pd) Coated Glass Characteristics

Note: The above product information is based on theoretical data and is for reference only. Actual specifications may vary.

Palladium (Pd) Coated Glass Applications

1. Electronics and Semiconductor Fabrication

• Conductive Barrier Layer: Prevents oxidation and contamination during semiconductor wafer processing, leveraging the chemically inert palladium surface.

• Interface Layer in Microfabrication: Provides stable bonding and uniform coating for semiconductor devices.

2. Industrial Instrumentation

• Sensor Devices: The palladium coating enhances signal integrity by reducing contact resistance, improving the reliability of sensor devices in industrial settings.

Palladium (Pd) Coated Glass Packing

The Palladium (Pd) Coated Glass substrates are carefully packaged in anti-static, cushioned carriers and sealed in moisture-resistant bags to protect them from environmental contaminants. The packaging ensures temperature and humidity control to prevent mechanical damage and preserve coating integrity. Custom packaging options, such as barcoding and compartmentalization, are available to meet specific storage and logistical requirements.

Additional Information

Glass substrates with thin metal coatings, such as palladium, are vital for semiconductor manufacturing. The palladium layer improves surface stability and conductivity, addressing key challenges in microelectronic device fabrication. Stanford Electronics uses advanced sputtering techniques to achieve precise film thickness and uniformity, ensuring that these substrates meet the rigorous standards required for high-performance semiconductor applications.