Lanthanum Hexaboride Sheet/Plate is used as cathode and even crucibles for the electric industry and frontier research. SAM provides lanthanum boride Plates and other LaB machined parts for both prototyping and scaled up productions: Lanthanum boride sputter target, Lanthanum boride (LaB) Slab/Tablet
As the Lanthanum: boron ratio is less than 1:4, LaB6 is considered a boron-rich material. Compared with other boride ceramics, lanthanum boride sheet, LaB6 sheet/plate, has more applications. This material could be machined into simple shapes, to be used as cathode and even crucibles for the electric industry and frontier research.
Product |
Lanthanum Hexaboride |
Structure |
Polycrystalline |
Symbol |
LaB |
Thermal Conductive |
47 W/mK (20℃) |
Cas No. |
12008-21-8 |
Thermal Expansion |
6.2 10-6K-1 (20-900℃) |
Atomic Mass |
203.78 g/mol |
Electrical Resistance |
ca.15 μΩ cm (20℃) |
Density |
4.72 g/cm3 |
Electrical Conductive |
6.65x104 S/cm (20℃) |
Melting Point |
2528 K |
Current Density |
150 A/cm2 (1950℃) |
Hardness |
87.5 RA |
Electron Emissivity |
2.6 eV |
Flexure Strength (σ) |
200 Mpa |
Fracture toughness (Kic) |
3.0 MN/m3/2 |
Chemical Composition
LaB (% min.) |
|||
99.9% |
|||
B(% min.) |
|||
31% |
|||
Rare Earth Impurities |
Non-RE Impurities |
||
Ce |
<120ppm |
Fe |
<250ppm |
Pr |
<150ppm |
Si |
<100ppm |
Nd |
<180ppm |
Ca |
<90ppm |
Sm |
<112ppm |
C |
<300ppm |
Y |
<250ppm |
Mg |
<100ppm |
|
Ti |
<100ppm |
* Thermionic emission (cathode)
* Plasma source for plasma enhanced coating(PECVD)
* Vacuum electron beam welding machine
* Electron beam surface reforming device
* Electron beam lithography device
* Transmission electron microscope
* Scanning electron microscope
* Surface analysis device
* Radiotherapy devices
SAMs’ LaB ceramics are carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Prototyping service is also available for other ceramics material
Product |
Lanthanum Hexaboride |
Structure |
Polycrystalline |
Symbol |
LaB |
Thermal Conductive |
47 W/mK (20℃) |
Cas No. |
12008-21-8 |
Thermal Expansion |
6.2 10-6K-1 (20-900℃) |
Atomic Mass |
203.78 g/mol |
Electrical Resistance |
ca.15 μΩ cm (20℃) |
Density |
4.72 g/cm3 |
Electrical Conductive |
6.65x104 S/cm (20℃) |
Melting Point |
2528 K |
Current Density |
150 A/cm2 (1950℃) |
Hardness |
87.5 RA |
Electron Emissivity |
2.6 eV |
Flexure Strength (σ) |
200 Mpa |
Fracture toughness (Kic) |
3.0 MN/m3/2 |
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