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TF1807 PTFE Powder

Catalog No
TF1807
Color
White
Appearance
Powder

Stanford Electronics is a trusted supplier and manufacturer of PTFE Powder, PTFE Tube, and PTFE Plate. Other customized PTFE products are also available upon your requirements.

Related Products: PTFE Tube, PTFE Plate/Sheet/Board, PTFE Skived Sheet/Tape, PTFE Rod

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PTFE Powder
PTFE Powder
Description
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TF1807 PTFE Powder Description

PTFE Powder Description

PTFE has characteristics including hygroscopicity, low coefficient of friction, good rigidity, extended elongation, solvent resistance, and good thermal stability. It has the highest melting point and lowest friction and is the most inert of all the fluoropolymers. Molding powders are excellent, fine cut granular resins, well suited for a variety of demanding chemical, mechanical, and electrical and non-stick surface applications.

PTFE Powder Properties

ITEM

DF101/102

Smoothness/Cleanness

First grade

Tensile strength(MPA)≥

27

Elongation at rupture(%)≥

250

Volume density(G/L)

500±100

Average grain(M)

220±50

Moisture content(%)≤

0.04

Melting point(℃)

327.5±5

Standard relative density

2.130-2.170

Thermal instability index≤

20

Electrical strength(MV/M)≥

60

For process

Molding

PTFE Powder Features and Benefits

This family of fine powder fluoropolymer resins offers a wide range of characteristics that include:

PTFE Powder Application

Insulation for wire and cable, tubing, pipelines, films, sintered and unsintered tapes, micro-porous membranes, heat shrink tubing, bushings, push/pull cables, profile shapes and other end-use components requiring a high-performance fluoroplastic material.

PTFE Powder Packaging

Our PTFE powder is clearly tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage which might be caused during storage or transportation.

TF1807 PTFE Powder Specifications

ITEM

DF101/102

Smoothness/Cleanness

First grade

Tensile strength(MPA)≥

27

Elongation at rupture(%)≥

250

Volume density(G/L)

500±100

Average grain(M)

220±50

Moisture content(%)≤

0.04

Melting point(℃)

327.5±5

Standard relative density

2.130-2.170

Thermal instability index≤

20

Electrical strength(MV/M)≥

60

For process

Molding

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