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(Discontinued) SN5593 Silicon Nitride Substrate

Catalog No
SN5593
Main Composition
Si3N4
Size
190.5*139.7 mm (customized)
Thermal Conductivity
80/130 W/m·k (25℃)
Bending Strength
750/600 MPa

Silicon Nitride Substrate is a type of ceramic material used in various applications, particularly in the semiconductor and electronics industries. Stanford Electronics has rich experience in manufacturing and supplying high-quality Silicon Nitride Substrates.

Related products: Silicon Nitride Welding Rod, Silicon Nitride Bearing Balls, Silicon Nitride Plate

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Silicon Nitride Substrate
Silicon Nitride Substrate
Description
Specifications
Reviews
(Discontinued) SN5593 Silicon Nitride Substrate Description

Silicon Nitride Substrate Description:

Silicon Nitride Substrate is a type of ceramic material used in various applications, particularly in the semiconductor and electronics industries. Silicon nitride is valued for its excellent combination of mechanical, thermal, and electrical properties. It is characterized by high strength, exceptional thermal stability, good electrical insulation, resistance to thermal shock, and chemical inertness, especially in harsh environments. It is the best material for high-power semiconductor device substrates and is widely used in power integrated circuits.

Silicon Nitride Substrate Specifications:

Size

customized

Thickness (mm)

0.25/0.32/0.38/0.5, etc.

Surface Roughness Ra

<0.6μm

Density (g/cm3)

≥3.2 g/cm3

Bending Strength

>700 MPa, 600 MPa

Vickers hardness

15.0 GPa

Young's modulus

310.0 GPa

Thermal Expansion Coefficient

2.5-3.1 X10-6/K

Specific Heat

680

 

Silicon Nitride Substrate Applications

 

Silicon Nitride Substrate Packaging

Our Silicon Nitride Substrate is carefully handled during storage and transportation to preserve the quality of our product in its original condition.

(Discontinued) SN5593 Silicon Nitride Substrate Specifications

Size

customized

Thickness (mm)

0.25/0.32/0.38/0.5, etc.

Surface Roughness Ra

<0.6μm

Density (g/cm3)

≥3.2 g/cm3

Bending Strength

>700 MPa, 600 MPa

Vickers hardness

15.0 GPa

Young's modulus

310.0 GPa

Thermal Expansion Coefficient

2.5-3.1 X10-6/K

Specific Heat

680

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