Stanford Electronics supplied high-purity materials and precision solutions to enable efficient Indium Phosphide (InP) wafer processing. This approach helped semiconductor manufacturers reduce costs, improve wafer utilization, and meet the increasing demand for 5G communication infrastructure.
Client | A global leader in optical semiconductors |
Year | 2018 |
Author | Stanford Electronics |
The rollout of next-generation communication technologies like 5G has drastically increased the need for high-speed, high-capacity data systems. While traditional silicon semiconductors have been the backbone of the industry, their limitations in handling high-frequency and high-speed applications have driven the adoption of advanced compound semiconductors like Indium Phosphide (InP).
InP is highly valued for its superior electron mobility, low power consumption, and excellent noise performance, making it the material of choice for optical transceiver semiconductor lasers used in 5G networks. However, the high cost of InP wafers poses challenges for manufacturers aiming to scale production while maintaining cost efficiency.
Balancing Cost Efficiency and Quality
To address cost pressures, manufacturers increased the die integration rate on InP wafers by reducing the street width (cutting width) to less than 50 μm. This approach maximized wafer material utilization but presented several challenges:
Manufacturers needed a solution that ensured precise and efficient wafer singulation while maintaining the integrity of the delicate InP material.
Materials for High-Precision InP Wafer Processing
Stanford Electronics provided high-purity materials tailored for use in precision wafer singulation processes. These materials were specifically optimized for the soft and delicate properties of InP, ensuring clean, accurate cuts even at ultra-narrow street widths.
Key contributions of Stanford Electronics included:
By supplying these materials, Stanford Electronics allowed the client to optimize their existing tools and processes without costly overhauls.
Driving Efficiency and Versatility
Stanford Electronics’ material solutions delivered significant improvements in wafer processing, including:
Efficient InP Wafer Processing for 5G Chips
The implementation of Stanford Electronics’ high-purity materials resulted in:
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